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This Japanese vegetable slicer can be used to cut long, wafer-thin leaves or thin noodles from vegetables. The prerequisite is a certain hardness of the vegetables, radish, for example, is ideal. The result comes very close to the result of manual cutting by Japanese chefs and can be easily and quickly achieved without the necessary skill.
Thickness of the cut sheets: 0.5 mm
Dimensions of the planer: 300×250×170mm
Wafer-thin vegetable leaves are good for:
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